GMB-L3TGL 工业主板 - 3.5" SBC / Intel® 11th Gen. Core i7-1185G7E (Tiger Lake-UP3 SoC) / DC电源

  • RoHS Compliant
  • 标准保修2年
  • Intel® 11th Generation Core™ i3/i5/i7 Processor (Tiger Lake-UP3 Platform)
  • Supported 2x DDR4-3200 SO-DIMM, up to 64GB
  • 2x RJ-45 LAN port by 2.5GdE + 1GbE by internal (pinheaded)
  • Equipped 1 x Full-sized Mini PCIe, 1 x M.2 Key M (2280) , and 1 x M.2 Key E (2230)
  • Supported triple-display, LVDS, HDMI, and DisplayPort (Internal Type C support DP only)

概要・特点

This product is a 3.5-Inch form factor industrial mainboard which based on Intel® Tiger Lake-UP3 Processor Core™ i3-1115G4E / i5-1145G7E/ i7-1185G7E with Windows 10 IoT Enterprise 2021 (4 languages) supported. The industrial-grade GMB-L3TGL210/310/410, with size of 146mm x 102mm, has high computing power, triple-display capability, and various expansion slots make it well-suited for factory automation, intelligent transportation, digital signage, self-service kiosks, and medical applications.
The Product supports two 260-pin DDR4-3200 SO-DIMM socket for up to 64GB of memory. To meet customer various needs, it also equipped with one Full-sized Mini PCIe slot with SIM socket. In addition, M.2 M key with mSATA support, and M.2 E key for wireless LAN require, it utilizes Intel® Iris® Xe Graphics to provide and feature triple-display capability through HDMI, DisplayPort and LVDS interfaces which enable multi-display in a limited space. Moreover, it has one RS-232/422/485 port, two RS-232 ports, total 3 ethernet ports with Intel controllers, four USB3.2 ports, two USB2.0 ports, audio interface (Mic-in, Line-out), one 4- bit GPIO port, one HDMI, one DisplayPort, and one LVDS port. The product can operates in temperature range from 0°C to 60°C and has +12~24V DC power supply input

应用实例

医疗应用

工厂自动化

设施信息显示终端

数字标牌终端

  • Intel® 11th Generation Core™ i3/i5/i7 Processor (Tiger Lake-UP3 Platform)
    • The product is equipped with an Intel Tiger Lake UP3 platform core processor. This processor family is renowned for its advanced processing capabilities, including multiple cores and threads, as well as improved graphics performance.
  • Supported 2x DDR4-3200 SO-DIMM, up to 64GB
    • Supported two 260-pin DDR4-3200 SO-DIMM socket for up to 64GB of memory to meet customer various needs.
  • 2x RJ-45 LAN port by 2.5GdE + 1GbE by internal (pinheaded)
    • 2x 2.5GbE with RJ45 connector on rear I/O by Intel I225 controller, and 1x GbE on internal pin header by Intel i210 controller.
  • Equipped 1 x Full-sized Mini PCIe, 1 x M.2 Key M (2280) , and 1 x M.2 Key E (2230)
    • Storage options include M.2 key M & SATA interfaces, such as SSD or HDD storage, for local data storage and operating system installation, 1 x Full-sized Mini PCIe for LTE nano-SIM holder (PCIe+USB Signal), 1 x M.2 Key M (2280) for storage (PCIe+SATA Signal), and 1 x M.2 Key E (2230) for wireless LAN (PCIe+USB Signal).
  • Supported triple-display, LVDS, HDMI, and DisplayPort (Internal Type C support DP only)
    • Supported triple display: - LVDS: Dual channel 18/24 bits (up to 1920 x 1200 @ 60Hz) - 1 x HDMI (up to 4096 x 2160 @ 30/24Hz) - 1 x Display Port (up to 4096 x 2304 @ 60Hz), and Internal Type C display: up to 4K (support DP only).

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