New Product Release: Palm-sized Fanless and Cableless BX-C210 Series Embedded Computer with Intel® Apollo Lake Platform
CONTEC has added three embedded PC models of the BX-C210 series with small form factor of 99mm x 46mm x 92mm (one layer) / 99mm x 63mm x 92mm (two layers) palm-sized to its product line. These three new products are released for sale on October 20, 2020.
Three new models in the BX-C210 series feature Celeron N3350 low consumption Intel Apollo Lake processor platform to achieve lower power consumption while providing superior cost performance. In addition, these three models have 12 to 30 VDC±20% wide voltage design, which could sustain unstable power supplier environment.
CONTEC’s newest BX-C210 series contribute significantly to the miniaturization of equipment while not hinder equipment design regardless of the installation location. Two types of mounting, wall mount and Din-Rail mount, are available to fit variety installation.
The BX-C210 series are fanless to ensure a totally spindle-less design that simplifies maintenance, relieving the concern about dust or foreign matter to get into the product. Besides, the design of this product is aimed to achieve stable and long-term operation in the environments, such as factories, where shock and vibration are continuously applied. Therefore, the cableless design, which boards are directly connected through golden fingers, are adopted in order to eliminate the malfunction risks due to cable dropout or disconnection.